Bead Electronics patents new design for hybrid interconnect pin - Connector Specifier

Bead Electronics patents new design for hybrid interconnect pin


Jan 12, 2012
Bead Electronics patents new design for hybrid interconnect pin

Bead Electronics announced that it was granted US patent no. 8,087,281 B2 on January 3, 2012, for its True Grip interconnect pin. The company says the True Grip pin features a hybrid design that combines the strength and reliability of through-hole interconnects with the ease of surface mount processing. Bead contends that the new design is the first end-to-end pin produced with a wide flange that can be automatically inserted into printed circuit boards.

According to the company, the pin's wide flange provides a defined seating plane for insertion depth control, a robust shoulder for seating the pin without distorting it, and a large surface area for soldering. The resulting 360 degree solder fillet produces a mechanically strong, low resistance electrical connection that is optimized for high reliability applications. "Bead Electronics has a long history of innovation," comments Ron Andreoli, Bead President. "Our True Grip pin is the latest example of how we apply our technical expertise and unique process capabilities to develop better solutions for the PCB assembly industry."

Bead Electronics manufactures precision continuous reeled, solid-wire and tubular contact pins for the telecom, automotive, connector and lighting industries. The company says its custom components deliver the performance of machined pins at the price of stamped products, that can be tooled in a fraction of the time. The Bead-formed manufacturing process, called swaging, is a high-speed, virtually scrapless cold-forming process capable of producing small metal parts that are dimensionally consistent and inexpensive. Bead Electronics is ISO 9001:2008 certified and provides 100% vision system inspection.

For additional information, visit www.beadelectronics.com

 


 


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