Quality conferences make a strong showing - Connector Specifier

Quality conferences make a strong showing


Dec 1, 2004

Several conferences this fall deserve mention for packing a powerful punch, in spite of small audiences. The 37th annual International Institute of Connector and Interconnection Technology (IICIT) symposium held in Dearborn, MI, Sept. 13–15, offered an impressive depth of technology in a single track of presentations. Although the conference registered fewer than 100 attendees, the diversity and non-commercial nature of the technical program was remarkable (see Connector Specifier, Oct. 2004, p. 3).

The Connector Technology Seminar, held Oct. 18–19 in Attleboro, MA, was a valuable educational experience, according to the attendees of this small but intense educational conference presented by Max Peel of Contech Research (Attleboro, MA) and Bob Mroczkowski of connNtext Associates (Manheim, PA), and co-hosted by Connector Specifier.

The seminar was designed to provide engineers with in-depth knowledge of connector technology. The sessions on Connector Fundamentals and Connector Degradation, previously covered in a similar fashion at IICIT conferences, covered in detail the basics of connector technology from the contact interface structures and contact plating materials to connector degradation and failure. Matt Parker, Product Designer at QA Technology (Hampton, NH), said he found the presentation very valuable. "Most of the topics were right on target to my area of design. The presenters are very knowledgeable, which was a real benefit."

The Fleck Connection Congress in Anaheim, CA, occurred Oct. 27–29, and had a more robust attendance of about 200. The Fleck Connection Congress focuses on business conditions and the global connector market rather than technology, so attendees tend to be high-level CEOs, rather than "techies."

Long-time industry veteran Ken Fleck of Fleck Research (Santa Ana, CA) presented market research results at the Fleck Connection Congress. After interviews with numerous companies at electronica Munich in November, he has noted a change in the European growth number from the results announced at the Fleck Congress. The real growth for European connector companies in 2004 was 1.3%.

"Because of the impact of the European currencies to the U.S. dollar, the change in Europe stated in U.S. dollars was 12.2%," said Fleck.

In this issue:

This month's first author, John Yurtin, is a legend at Delphi Automotive Systems. He has more than 38 years experience in components and interconnect technology development in global assignments and various engineering positions. Holding 14 patents, John is a member of the Delphi Innovation Hall of Fame, and a Connector Specifier editorial advisor. In this issue, he details automotive grounding systems in, "So…what's the significance of those ground circuits, anyway?" The title is one of a series of "So…what" articles authored by Yurtin.

Don't miss our second feature this month, co-authored by Wayne Zahlit, Mark Schwartz, and Dale Reed of Trompeter Electronics, which presents a look at the evolution of the BNC connector.

Click here to enlarge image

See you in 2005!

Valerie Coffey, Editor-in-Chief
valeriec@pennwell.com


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