FLIP-CHIP BONDER
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The high-speed flip-chip bonder, the FCX501, is ideally suited to the mass production of a variety of compact high-frequency electronic devices. The machine is capable of ultrasonic and thermosonic flip-chip bonding processes, which create a nonmetallic bond with high thermal and electrical conductivity. Initially, the FCX501 will be used for high-speed gold-to-gold flip bonding with future capabilities to include high-speed thermal compression bonding. The FCX501 is highly flexible and can handle a variety of interconnect technologies and die/substrate combinations. PANASONIC FACTORY AUTOMATION, ELGIN, IL www.panasonicfa.com
MULTI-PICK FEEDER
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This new innovation in feeder technology significantly increases overall production throughput by enabling standard placement cells to pick and place multiple discrete interconnect pins in a single cycle. The new Multi-Pick feeder technology is based on proven AutoFeeder mechanisms and uses the machine's existing electrical, pneumatic, and waste-removal interfaces. The self-contained AutoFeeder slide mounts onto and removes from the machine exactly like the feeders of each equipment manufacturer. This enables seamless "plug-and-play" compatibility for handling a variety of discrete interconnect components. AUTOSPLICE, SAN DIEGO, CA www.autosplice.com
OVER-MOLDING SYSTEM
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For use with Mil-M-24041C resins, this heated over-molding system is designed for use with resins conforming to the MIL-M-24041C specification for over-molding of harness breakouts, watertight electrical connectors, cables, cable-end seals, printed circuitry, and other electrical components. Typical operating temperature of the cart is 140º F (60º C). Some of the other system features of model 9450 double acting meter/mix dispense system are that it contains two 10 gallon capacity feed tanks and two positive displacement piston feed pumps. It also has a heated cart to fully enclose the fluid components. SHEEPSCOT MACHINE WORKS, NEWCASTLE, ME www.sheepscotmachine.com
PICK-AND-PLACE AUTOMAT
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The CLM9000plus is based on a new software and hardware platform. The mechanical improvements include a new drive system, which results in a 20% placement speed increase and an improvement in accuracy and repeatability. Bearings have been further improved, which results in a longer life and less wear. A newly available calibration set includes glass plates and components and allows customers to verify on site the accuracy of the machine, if needed, for ISO9000 protocols. ESSEMTEC, GLASSBORO, NJ www.essemtec.com
VISION SENSOR
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The presencePlus P4 GEO vision sensor inspects for correct features regardless of product orientation or position in the sensor's field of view, eliminating complex mechanical fixturing. The P4 GEO offers several features that make it particularly easy to deploy on the factory floor. A remote Teach feature allows the sensor to learn new features it will need to inspect for without connecting to a PC or shutting down the line. The high-throughput feature-detection abilities of the sensor make it ideal for a broad range of applications in the packaging, pharmaceutical, assembly, baking, automotive, metalforming, and semiconductor industries. BANNER ENGINEERING, MINNEAPOLIS, MN www.bannerengineering.com
WIRE-PROCESSING PLATFORM
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A second generation of the Primo wire-processing platform has been released recently. The new Primo SLT is an economically priced wire processing machine for dual-end terminating of open- or closed-barrel terminals and other processes. The Primo SLT is fully programmable with added features that include two process stations on side A of the machine and a wire doubling option for side B. The Primo SLT also includes a standard 2-m motorized collection conveyor. MEGOMAT USA, PEWAUKEE, WI www.megomat.com
MARKING SYSTEM
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Designed to be easy to operate, this marking system requires no PC or PC skills for setup or operation. Dozens of enhanced functions are included, such as sequential serial numbering, date coding, and the ability to mark graphics and logos. File size and storage are limited only to the capacity of the included CompactFlash card. A batch counter, cycle timer, and job status are displayed on the LCD screen while a keypad provides the operator interface with a simple menu. KWIKMARK, MCHENRY, IL www.kwikmark.com
WIRE BONDER
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The Model 8000 gold ball-and-stitch thermosonic wire bonder for precision gold-wire-bonding applications is for complex multichip applications, high I/O count devices, and gold-ball bumping for flip chips. The large-area positioner enables a full 72" × 72" work area (10X more than most high-speed ball bonders), enabling large substrates to be bonded in one pass. Deep-access bonding with a z-stroke of 20 mm accommodates placement into many of the deepest electronics packages. A finished bond-height consistency of 2 mm (at 3 sigma) is achieved with better than 5-mm placement accuracy. PALOMAR TECHNOLOGIES, VISTA, CA www.palomartechnologies.com
