RESEARCH TRIANGLE PARK, NC — The MCNC Research & Development Institute (MCNC-RDI), a North Carolina-based nonprofit research organization, has been awarded a Phase II research grant for a project to develop advanced interconnect technology for infrared detector systems to be used by the U.S. Department of Defense (DoD) in high-performance military and space surveillance applications.
This research contract supports the Vertically Interconnected Sensor Arrays (VISA) program of the Defense Advanced Research Projects Agency's (DARPA) Microsystems Technology Office. DARPA is the central research and development organization of the U.S. DoD.
This research contract is a collaborative effort between MCNC-RDI and DRS Infrared Technologies. The primary objective is to develop three-dimensional (3-D) architectures and circuits that enable massively parallel signal processing for high-resolution infrared focal plane arrays (FPAs) necessary to address future strategic and tactical systems.
MCNC-RDI was chosen by DARPA to develop 3-D interconnect technology that would enable the integration of the FPAs with multiple layers of silicon read-out integrated circuits (ICs). After 18 months of research and development, the joint project has reached Phase II, a milestone that indicates the technology has achieved operability.
The 3-D interconnect technology provides for the integration of the detector arrays with multiple layers of ICs by means of insulated and metallized vias (vertical holes) etched through the body of the IC chips. The resulting multi-layer structure offers optimal short interconnect paths and enables significantly higher inter-layer bandwidths for more demanding signal processing requirements. Incorporating this unique 3-D technology will ultimately improve the performance of the infrared sensing systems by significantly increasing processing capability and signal integrity.
"We are thrilled to have the opportunity to partner with DARPA and join forces with DRS on this important project," said Ken Williams, Ph.D, vice president of the Materials & Electronics Technologies Division at MCNC-RDI. "By achieving Phase II, our collaborative efforts with DRS have proven that this technology can work, and a true paradigm shift in the performance and operability of 3-D integration technology has been demonstrated."
MCNC-RDI's 3-D interconnect technology increases IC performance while reducing weight and volume. Devices featuring 3-D interconnect technology demonstrate improved processing speed, less power consumption, lower cost, and a smaller footprint.
DARPA initially awarded MCNC-RDI the VISA contract in 2003. Phase II began in July 2004 and will last approximately 18 months.
