FALL RIVER, MA — Paricon Technologies Corporation, a privately held manufacturer of a unique, ultra-low-profile advanced interconnection technology called BallWire technology, has announced data proving its PariPoser material can support 50 Gbit/s transfer rates in electronic systems with low loss and crosstalk. According to the company, the breakthrough greatly extends the ability to economically interconnect high-performance systems.
Paricon's president and chief executive officer, Dr. Roger E. Weiss, commented, "We always knew we had a high-performance capability, but are extremely pleased that our separable interface has been tested and validated by independent electronic experts to be the fastest separable interface in the world."
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Paricon commissioned Teraspeed Consulting Group LLC (Naragansett, RI), an engineering firm specializing in the design of high-performance systems, to design and characterize a "simple but elegant, blazing fast" interconnect system, using Paricon's technology and using standard off-the-shelf system components to simulate a typical electronic system.
Paricon also commissioned GateWave Northern (Madison, WI), a company specializing in the testing and characterization of high-speed systems, to perform additional testing up to 40 GHz. Gert Hohenwarter, GateWave Northern's president, said, "Perfor-mance claims can be made, but when you hook-up a system and test it, the data separates reality from marketing. The Paricon contact system is simple, fast, crisp, and clean in all performed tests."
Specially designed for high-density electrical interconnections, PariPoser interconnects are anisotropically conductive materials that make uniform electrical connections between opposing contact areas using BallWire conductive columns, silver-plated nickel particles aligned and regularly distributed within a sheet of silicone rubber. The custom formulation of the interconnects depends on the pad pitch of the application.
Characterized by high thru-conductance and high in-plane isolation, PariPoser interconnects were designed for fine-pitch, non-planar interconnect applications. The material is formulated and manufactured to provide high mechanical shock relief while maintaining mechanical stability over an extended service life. Ideal applications include high-density I/O interconnections where soldering is difficult, such as device test interconnections, and LAND- and BALL-grid-array connections. The PariPoser material is placed between the pads to be joined, where the application of pressure creates a connection with a stable resistance of approximately 6 mΩ. Solder and flux are eliminated, eliminating heat damage induced during testing or repairs and the use of hazardous cleaning solvents.
Scott R. McMorrow, Teraspeed's president, said, "Paricon material allows the transmission of extremely high-performance signals, invisibly, through the system. The electrically transparent separable contacts allow for minimal impedance mismatch through the interconnection structure."
Resiliant rubber
The primary ingredient in the standard PariPoser interconnect is resilient silicone rubber. Its elasticity allows the material to compensate for surface irregularities between adjoined components, which the company claims lowers component and assembly costs and reduces rejection rates. Inherently reliable and reusable, the silicone-rubber base material seals out contaminants in harsh environments. PariPoser interconnects are designed to be shaped and cut, allowing designers greater flexibility in product configuration and product changes.
Tested in the lab against gold-plated connectors, PariPoser interconnects withstood up to 500,000 cycles of repeated high-compression excursions.
Weiss continued, "The system we tested can be applied to inter-connection platforms including high-speed board-to-board connectors, backplane and mezzanine connectors, cable-to-board connectors, and cable-to-cable connectors. Separable interconnection is no longer a limiting factor in system performance."
