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Aries Electronics recently released what it calls the industry's first CSP sockets that accept any area-array device for high-temperature testing up to +200°C. The AR4HT Series sockets incorporate a low-profile 0.45 mm contact structure (compressed) that the company says is shorter than other low-profile contacts and provides excellent compliance for reliable ATE testing and burn-in.
According to the company, for the first time, applications that require high-temperature device testing and burn-in, as well as those with high-frequency bandwidth, low inductance and high current conditions, can now incorporate cost-effective and high-reliability CSP socket technology to test and burn-in virtually any area-array device at temperatures up to +200°C. The sockets are employed in military, aerospace and geophysical environments as well as in research and development.
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The AR4HT sockets accommodate a variety of area-array devices including BGA, LGA, QFN, DFN, CSP, MLCC and POP as well as bumped die with full and partial arrays. Full socket operating temperature is -55°C to +200°C with a life expectancy of more than 10,000 actuations. The socket can accommodate IC devices with a pitch of 0.4 mm or greater as well as mixed pitch environments.
The interposer set is comprised of silver particles within a silicon elastomer with a patented polyimide core. Initial contact force is 20 to 30 grams per lead. As with all Aries Test and Burn-in Sockets, the new AR4HT Series is available in custom sizes and configurations to suit specific applications. Pricing for an AR4HT socket starts at $175. Delivery is 20 work days, ARO.
