Dow Electronic Materials awarded for High Density Interconnect advancements - Connector Specifier

Dow Electronic Materials awarded for High Density Interconnect advancements


Aug 8, 2011

Dow Electronic Materials (NYSE: DOW) has been awarded by PCB manufacturer Multek, recognizing Dow's technical innovations surrounding increased microvia reliability in High Density Interconnect (HDI). Among 6 suppliers awarded in the 2nd Multek Zhuhai PCB Quality Forum in Hong Kong, held earlier this year, Dow Electronic Materials was honored with First Prize.

“We are pleased to recognize Dow Electronic Materials’ expertise in increasing microvia reliability in HDI with this award,” said BabHui Lee, Senior QA Director of Multek. “[The company's] outstanding ability in failure analysis and process control, as well as innovative technology for desmear and electroless copper processes, are critical for Multek to create advances for next generation electronics.”

Related News:  Dow hikes cable materials pricing

Dow Electronic Materials’ products that increase microvia reliability in HDI, as described by the company, include:

"Desmear, the new CIRCUPOSIT Hole Prep 4126 Advanced Sweller, which offers excellent cleaning performance for smear removal and creates outstanding surface texture that results in higher reliability performance after electroless copper deposition. It provides cost-effective and sustainable benefits with optimized simple process and lower solvent concentration. The new Advanced Sweller is capable of handling both normal and high performance laminates with a wide operation window.

The new CIRCUPOSITTM 7950 Electroelss Copper, which provides high adhesion between dielectric and copper with low roughness, outstanding plating coverage on both via bottom and surface, excellent bath stability and reliability performance, making it the best choice for current and next generation ultra fine line for SAP [Semi-Additive Process] metallization."

“Due to the strong demand for smart phones and tablets, microvia reliability for HDI has been critical to the advances for PCB," commented Helen Zhang, global general manager in Dow Electronic Materials. "Receiving the award is a demonstration that with our outstanding technology and customer service, Dow Electronic Materials is passionately innovating with customers to create a connected world.”

More Info:
www.multek.com
www.dow.com

 


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