Copper backplanes at 10 Gbits/s to be a reality at DesignCon 2004
WALLINGFORD, CT — Northrop Grumman's Winchester Electronics and Interconnect Technologies divisions have announced that they are combining their "synergistic technologies" with the field-programmable gate arrays (FPGAs) of Xilinx (San Jose, CA) at DesignCon 2004. The combined technologies will demonstrate multi-channel serial non-return-to-zero (NRZ) 10-Gbit/s signaling operating over a manufacturable backplane system at DesignCon, Feb. 2–5, in Santa Clara, CA.
Company officials said this is the next stage in the collaborative effort between the companies to move the 10-Gbit/s interconnect agenda from the laboratory arena into the manufacturing arena. According to Doug Hynd, director of technical marketing for Connecticut-based Winchester and Missouri-based Interconnect Technologies, the technology amalgamates Winchester's SIP1000 I-Platform connector system, Interconnect Technologies' advanced backplane design and PCB fabrication capabilities, and Xilinx's new Virtex II-Pro X FPGAs featuring 10-Gbit/s transceivers. Based on an Advanced TCA mechanical footprint, the reference design will feature a 14-slot, 30-layer Rogers 4350 backplane.
"Our collaborative achievement at DesignCon 2004 will mark a significant milestone for the industry," says Brian Seeman, director of technical marketing at Xilinx's Communications Technology Division. "We will have moved from demonstrating one or two 10-Gbit/s active channels on a backplane to developing a multi-channel platform that shows how the significant issue of 10-Gbit/s multi-aggressor crosstalk can be managed through a combination of high-performance connectors, judicious design practice, complex PCB fabrication, and straightforward use of next-generation multi-channel 10-Gbit/s transceivers."
According to Hynd, the passive interconnect layer of the system is based on Winchester's SIP1000 I-Platform compression-mount connector technology, which precludes the need for pressfit terminations and uses small and fully back-drillable PCB via structures (see Figure). This provides tight control of channel impedance within 10 Ω of tolerance and maximizes passive-channel-transmission distance. Most important, says Hynd, it also reduces power loss due to reflected signal noise and power required for transceiver signal conditioning.
He also notes that the SIP1000 connector addresses the crosstalk challenge on two fronts. Internal connector crosstalk is kept to less than 0.5% through a fully shielded, conductor-wafer structure. The much more difficult crosstalk issue presented by inductive coupling in connector-via fields is addressed by the connector's unique diamond pattern Isol-Via crosstalk suppression routing architecture. This enables ground vias to be interspersed between the signal vias of the backplane and daughtercard PCBs reducing FEXT by 66% and NEXT by 96% compared to traditional 2-mm grid pattern connectors. These figures can be further improved by optimizing the layout strategy and backdrilling vias.
The demonstration of active interconnection through the system is provided by Xilinx's new Virtex-II Pro X FPGAs, which incorporate RocketIO X multi-gigabit transceivers with operating ranges from 2.5 to 10.3125 Gbits/s per channel. It also offers channel bonding and several performance-tuning features, including pre-emphasis, receiver equalization, differential voltage swing, and on-chip termination. Most significant, according to Xilinx, the device incorporates up to 20 transceivers, making high-10-Gbit/s transceiver density a practical reality.
"The availability of both manufacturable high-speed backplanes, along with 10-Gbit/s-capable FPGAs, lays the cornerstone for the next tier of high-performance systems," says Hynd. "The flexibility of a platform FPGA having such high-speed I/O capability enables systems designers immediately to start development of their next-generation designs."
Future plans for the collaboration between these companies, expected to be announced later this year, will create referenceable designs with even greater levels of manufacturability and architectural relevance, say company officials.
November component order index hits two-year high
ARLINGTON, VA — The monthly order index compiled by the Electronic Components, Assemblies & Materials Association (ECA) hit a two-year high in November, marking the fourth consecutive month of growth (see Figure). The ECA represents manufacturers and producers of passive and active electronic components, component arrays and assemblies, and materials and support services.
 The comparative monthly index of electronic-component orders has shown growth for four consecutive months. |
Could this be more evidence of an upturn? The index of electronic-component orders for November 2003 averaged approximately 75% of the average month in 1996. The year-over-year dollar change in orders was up over 25% from November 2002. "The news from the index has been good over the longest span of time in a couple of years," says Bob Willis, ECA president. "I think we can safely say that the fourth-quarter return to growth predicted over the last three years has finally arrived."
The monthly component report comes on the heels of overall good news for the economy and a recent prediction by research group IDC of a "tech resurrection" in 2004. An important force for the upturn, according to IDC, is the buying power of consumers, as "they merrily embrace new technologies" like cameraphones, DVD recorders, and broadband—all of which rely on electronic components.
"Electronic components are the foundation for consumer devices and IT hardware," says Willis. "When these sectors grow, they naturally pull along electronic components."
Accelerant introduces quad 6.25-Gbit/s transceiver
BEAVERTON, OR — Accelerant Networks has announced the introdution of AN6620, a quad binary 6.25-Gbit/s SERDES transceiver with adaptive Decision Feedback Equalization (DFE). With this device, Accelerant enables standards-based binary SERDES to interoperate at speeds up to 6.25 Gbits/s for applications in network, server, and storage system development. Compliant with emerging 6.25-Gbit/s standards and 2- to 3-Gbit/s links for SATA, SAS, FC, and PCI Express, the next-generation silicon technology builds on the first pass success of previous AN6000-family products.
Accelerant first introduced DFE technology last October at 3.125 Gbits/s for legacy binary operation of its AN6420 transceiver. The improved DFE technology offers a wider range of operation, performing from 622 Mbit/s to 6.25 Gbit/s and beyond. The implementation is fully self-adaptive and self-contained in the receiver, achieving optimal bit-error rate (BER), regardless of the performance of the far-end transmitter. This enables interoperability with a wide range of binary devices across a gamut of existing standards. In addition, the AN6620 includes full crossconnect functionality to enable a wide variety of flexible data-path options, including 1:1, 2:1, and 4:1 aggregation all while consuming less than 1 W of power.
"Accelerant is primarily associated with proprietary multilevel signaling technology due to its leadership in adaptive equalization in 10-Gbit/s-plus PAM4," says Jag Bolaria, senior analyst for the Linley Group. "With this latest release, the company shows us that its core competencies are independent of signaling. Extending its binary signaling technology to 6.25 Gbits/s will put Accelerant ahead of a crowd of established silicon vendors yet to achieve promised results."
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The AN6620 contains the same desirable features found in the previous family of AN6000 devices, including Accelerant's "Lab-in-a-Chip" diagnostics, continuous adaptation, and extremely low power consumption. The availability of these features in a binary transceiver provides more choices for system developers in projects that lean toward binary signaling, such as emerging 6.25-Gbit/s backplane standards, and standards-based systems operating at slower 2- to 3-Gbit/s speeds, such as Serial ATA, Serial Attached SCSI (SAS), Fiber Channel, and PCI Express. Built-in diagnostics assist with high-speed system design. The Lab-in-a-Chip feature provides on-chip BER-tester, scope, and Vector Network Analyzer (VNA) capabilities without external connections to the channel.
"Each new generation of AN6000 series devices has addressed a new level of interoperability with the wide range of interconnects used in system development—from the AN6420, which combines PAM4 with legacy binary capability, to this newest device that extends that proven binary functionality to 6.25 Gbit/s," says Bill Hoppin, vice president of marketing for Accelerant Networks. "Ultimately, system developers benefit from a wide range of adaptive solutions that enable faster, less-expensive upgrades of their existing chassis-based network, server, and storage systems to next-generation speeds and capabilities."
The AN6620 offers full compatibility with emerging backplane standards up to 6.25 Gbits/s as well as core physical layer (PHY) compliance to PCI Express 1.0A, SATA, and SAS at 50% of the power requirement of competing solutions. Accelerant will bring products to market in early Q404 targeted for the high-growth server and storage markets.
An internal dual-crossconnect allows enhanced MUX/DEMUX modes for internal aggregation of data up to 4:1, enabling system developers to achieve high-speed transmission using lower-speed input links. Using 4:1 MUX/DEMUX mode, four 1.25-Gbit/s links can be aggregated to a single 5-Gbit/s interconnect to achieve high-speed signal transmission across cables or backplanes while reducing board real estate requirements as well as associated power consumption of redundant transceivers. The integrated dual-crossconnect also enables multicasting support for simultaneous redundant switching.
CommScope to acquire Avaya Connectivity Solutions
HICKORY, NC — CommScope has announced a definitive agreement with Avaya (Basking Ridge, NJ) to acquire its Connectivity Solutions (ACS) business for cash and securities valued at approximately $263 million. ACS designs and manufactures enterprise structured cabling solutions for local-area networks (LANs) and telephone central offices. Enterprise structured cabling systems connect personal computers, workstations, phones, LANs, and other communications devices through buildings or across campuses. The strategic acquisition is expected to double CommScope's size.
With the highly complementary addition of the connectivity solutions business, CommScope will be a global leader in the enterprise LAN business, in addition to its current position as the world's largest manufacturer of broadband coaxial cable for hybrid fiber/coaxial (HFC) applications and a leading provider of fiberoptic cable for HFC. CommScope also has a growing position in the wireless business. ACS had revenues for the 12 months ended Sept. 30, 2003, totaling $542 million, according to Avaya's public information, while CommScope had revenues of $555 million for the same period.
The strategic acquisition of ACS enhances CommScope's global brand and market presence in the enterprise LAN business. ACS is a well-known brand in structured cabling for LAN solutions, and is known for its technological innovation, particularly with its SYSTIMAX end-to-end connectivity solutions for customers' on-premises voice and data networking needs.
CommScope's fiberoptic-cable technology, enhanced through its relationship with OFS, complements ACS's enterprise LAN product offering. Under the terms of the agreement, Avaya will receive $210 million in cash, an $18-million convertible subordinated note from CommScope, and $34.9 million in CommScope common stock, subject to adjustment. CommScope will also assume up to approximately $75 million of other specified liabilities of ACS, primarily related to employee benefits. The transaction, which is subject to approval by necessary regulatory authorities, is expected to close by the end of the year.
"ACS is an excellent strategic fit and a logical step in the continued growth and development of CommScope as we execute our last mile strategy," says Frank M. Drendel, chairman and CEO of CommScope. "This transaction represents a unique opportunity to acquire a preeminent industry player at an attractive valuation and establish CommScope as a global leader in the enterprise LAN area. As the recognized leader in data connectivity innovations, ACS has a premier range of products, a successful R&D program, talented personnel, and extensive global customers. As we move forward, we believe we can further enhance the long-term growth and profitability of the SYSTIMAX product line."
Laird acquires Orcus
Laird Technologies (St. Louis), provider of EMI solutions, announced in October its acquisition of Orcus. With a 12,000-sq-ft facility in Overland Park, KS, Orcus develops, manufactures, and sells thermal-interface materials in the electronics industry. Laird Technologies manufactures a wide range of EMI shielding materials and related products for the computer, telecommunications, aerospace, defense, general electronics, medical equipment, and automotive industries. The acquisition of Orcus increases Laird's capabilities to solve customer's heat problems in addition to EMI.
Also in October, Laird Technologies and Japan-based Seiren Co. Ltd. announced a broad-based intellectual property licensing agreement in the field of conductive foam (CF) EMI shielding. Under the agreement, Laird has an exclusive license to Seiren's CF patents, and they will cross-license any new patents obtained in the field of CF. www.lairdtech.com
Calling connector papers
The 37th annual IICIT Connector & Interconnection Technology Symposium and Trade Show committee invites submission of abstracts for consideration at the 2004 conference in Dearborn, MI, Sept. 13–15. Short-course descriptions are also being solicited. The abstract deadline is Feb. 13. Key topics include Radio Frequency Interconnection; Materials, Finishes, and Platings; Quality; Test Methods; High Speed Connectors; Automation; Personal Computer Interconnection; Surface Mount Technology; Automotive Interconnections; Fiber Optics; Spaceflight Connector Technology; and Medical Applications. Papers should describe experiments or new techniques and contain technical, economic, or appropriate test data. Material should be original, unpublished, and non-commercial in nature. Abstracts can be submitted online. www.iicit.org
Corning selects distributor
Corning Cable Systems (Hickory, NC), manufacturer of fiberoptic and copper communications network infrastructure solutions, has selected TVC Communications (Annville, PA) to distribute its portfolio of products to the cable TV (CATV) industry in the United States. Broadband solutions provider TVC will distribute Corning Cable Systems' line of tip-to-tip products for the CATV industry, from the headend to the customer premises. Palisades Associated completed the acquisition of TVC and its affiliates last September, helping it emerge out of bankruptcy. www.corning.com/cablesystems
WHAT'S NEW
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SERIAL ATA LINE — Latching Serial ATA cables and connectors incorporate a positive latch that ensures the Serial ATA connections in desktop storage applications. The latching enhancements are ideal for the server and networked storage markets. The latching Serial ATA cables and connectors eliminate disconnections during shipping and handling while maintaining low costs. Signal cables are available in straight or right-angle versions; PCB signal plugs are available in vertical or right-angle SMT versions. MOLEX, LISLE, IL. www.molex.com/product/serial_ata.html
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FIBEROPTIC BROADBAND — These fiberoptic node cables and components are designed for multiple-system operators (MSOs). The cables are constructed using "LightScope ZWP" technology that is available with flexible connector and node-interface options. The cables connect the optical distribution node to the backbone optical fiber used in broadband cable TV networks. COMMSCOPE, HICKORY NC. www.commscope.com
NEWSMAKERS
SEMFLEX (Mesa, AZ), a manufacturer of coaxial cable for the telecommunications, mil/aero, and test instrumentation markets, announced the appointment of a new sales-rep organization, Tech Marketing Associates (Costa Mesa, AZ). Tech Marketing Associates will serve the Southern California region.
 (from left to right) Peter J. Murphy, C. James Herring and Stephen Wohlgemuth |
IPC-Association Connecting Electronics Industries (Northbrook, IL) has announced new officers and directors elected at its 2003 IPC Annual Meeting Sept. 28 to Oct. 2 in Minneapolis. For terms ending Dec. 31, 2005: Peter J. Murphy, president and CEO at Parlex Corp. (Methuen, MA), was elected chairman of the board; C. James Herring, president and CEO at Circuit Service (Wheeling, IL), was selected to be IPC vice chairman; and Stephen Wohlgemuth, vice president of Photocircuits (Glen Cove, NY), was elected IPC secretary/treasurer.
 John Struhar |
Ortronics (New London, CT) announced the appointment of John Struhar as director of fiberoptic structured cabling solutions. In this newly created position, Struhar will lead business development initiatives in the fiberoptic market segment, using his extensive experience in fiberoptics, networking technology, and cabling-system infrastructure to expand the company's presence in this sector of the industry. Struhar is a founding member, and chairman since 2001, of the TIA Fiber Optics LAN Section (FOLS), promoting the technical and economic advantages of fiber technology in customer-owned networks. He is also a published author and frequent presenter on technology trends, products, and systems in 12 countries.
 Thomas Ng |
Express Manufacturing (Santa Ana, CA), an electronics manufacturing services provider, announced that Thomas Ng has joined the company as director of engineering. Ng will spearhead the operations of the Engineering Service Group, including new-product introduction and PCB design and layout as well as hardware and systems design.
Rosenberger LEONI Site Solutions (Lancaster, PA) announced the addition of Bill Corondan and Rick Harris to their North American sales initiative. Corondan and Harris will develop and implement the sales strategy of the Rosenberger LEONI Site Solutions FlexLine products throughout North America. Corondan and Harris are headquartered in the Dallas area.
