PCMCIA Announces New Card Technology
SAN JOSE, Calif. — The Personal Computer Memory Card International Association (PCMCIA) announced the development of a new specification codenamed "NEWCARD." The new specification builds on the successful characteristics of the PC Card: reliability, ease of use and industry support while delivering external expansion with reduced size, increased speed, lower costs and support of advanced serial I/O technologies, USB 2.0 and PCI Express.
Two key industry groups, the USB Implementers Forum (USB-IF) and the Peripheral Component Interconnect-Special Interest Group (PCI-SIG), are collaborating with the PCMCIA to support the underlying bus technology used in defining the NEWCARD form factor. PCMCIA will lead the NEWCARD specification development effort. NEWCARD marks the first time expansion card specifications will be shared among mobile and desktop PCs.
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"Innovative applications and technologies continue to be developed at an amazing rate, requiring PC clients to have the latest expansion capabilities," said Brad Saunders, Chairman of the PCMCIA. "By drawing upon USB 2.0 and PCI Express, the NEWCARD specification will bring serial bus technology to a smaller form factor that offers more performance and improved ease of use. This new specification will revolutionize how PC developers and OEMs utilize the expansion slot for next-generation features such as wireless networking, storage and card readers.
"This initiative also marks the first time that three major industry work groups, PCMCIA, USB-IF and PCI-SIG, have partnered to promote and validate a specification. We expect NEWCARD to have a widespread impact on the industry because it leverages existing technology to make PC expansion easier and less expensive," added Saunders.
NEWCARD is targeted for both mobile and desktop system developers and OEMs seeking small form factors and sealed systems for smaller and thinner mobile system designs. Consumers will benefit from the compatibility of add-in cards between their mobile and desktop systems, similar to how USB devices can be shared between laptops and desktop clients. Products supporting NEWCARD are scheduled to debut in the second half of 2004.
TIA Publishes Fiber Optic Test Standards
ARLINGTON, Va. — The TIA has published four new fiber optic test procedures. The purpose of FOTP-4, "Fiber Optic Component Temperature Life Test," TIA/EIA-455-4C (released June 2002 and revision of TIA/EIA-455-4B) is to determine the effects on the optical and mechanical characteristics of fiber optic components resulting from exposure to an elevated temperature for a specific length of time. The procedure is applicable to all types of fiber optic devices including connectors, splices, passive branching devices (couplers), etc.
The intent of FOTP-5, "Humidity Test Procedure for Fiber Optic Components," TIA/EIA-455-5C (released June 2002 and revision of TIA/EIA-455-5B) is to evaluate the optical and material properties of fiber optic components as they are influenced or deteriorated by the effects of high humidity and heat conditions. The procedure is applicable to all types of fiber optic devices including connectors (or composite fiber optic and electrical interconnecting devices), splices, passive branching devices (couplers), etc. This is an accelerated environmental test, accomplished by the continuous exposure of the specimen to high relative humidity at various temperatures.
The purpose of FOTP-11, "Vibration Test Procedure for Fiber Optic Components and Cables," TIA/EIA-455-11C (released June 2002 and revision of TIA/EIA-455-11B) is to determine the effects of vibration within the sinusoidal and random vibration environments that may be encountered during the life of the fiber optic component. The procedure is applicable to all types of fiber, cable or cable assemblies, and fiber optic devices including connectors, splices, passive branching devices (couplers), etc.
The last one, FOTP-122, "Polarization Mode Dispersion Measurement for Single-mode Optical Fibers by Stokes Parameter Evaluation," TIA/EIA-455-122-A (released August 2002 and revision of TIA/EIA-455-122) describes a procedure for measuring the polarization-mode dispersion of singlemode optical fibers. The test method is restricted to wavelengths greater than or equal to that at which the fiber is effectively singlemode. On the basis of providing the full polarimetric characteristics of the fiber, this method is considered as a reference test method against which any other method shall be compared to in case of a dispute of for calibration.
Advanced Interconnect and 3M to Provide Multifiber Systems
FRANKLIN, Mass. — Advanced Interconnect Inc. (AI), a wholly owned subsidiary of Woodhead Industries Inc., and 3M have signed a licensing agreement that will enable AI to independently manufacture and sell the OGI Multi-Fiber System developed by 3M. This patented, high-density, panel-mount and backplane feedthrough system offers several improvements over existing parallel optic solutions. The agreement further enhances AI's line of fiber connectivity products. "We are very excited about adding a premier interconnect system like OGI to our product portfolio", said Bruce Geltman, AI's Vice President of Sales and Marketing. "The licensing agreement will help expand the acceptance of multifiber backplane technology, and further enhances AI's position as a major supplier of integrated connectivity solutions." The components will now be more accessible in the marketplace by providing a second source of supply for the telecommunications, networking and high-speed computing equipment markets.
Jim Stanley, Marketing Manager for 3M, adds, "We chose AI as an OGI licensee partner for its experience manufacturing fiber optic cable assemblies, high-quality standards and commitment to customer satisfaction. These factors are an integral part of what OGI represents in the market as a shielded, robust, high-density optical interconnect solution, and we wanted a partner who was driven by those same values to expand the OGI global market footprint."
Blind-mate backplane quad couplings and panel-mount couplings for single- and four-port requirements will mate OGI connectors, each of which houses 8- or 12-fiber MT ferrules in a half-inch nominal interface. The metal components in the couplings improve EMI shielding performance, and the independent shutter system enhances eye safety. AI will also supply a cleaning system, developed by 3M, that enables customers to clean OGI connectors after they are installed in a backplane or front panel, addressing shortcomings found with other commercially available backplane solutions.
WHAT'S NEW:
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CARD CONNECTOR — Series 5036 Subscriber Identity Module (SIM) Connector features an optional card retention lock, low-profile metal body, integral SMT strain-relief tabs, card-detect switch, push/push card ejector and optional location bosses. Applications include WLAN PC cards, cellular phones, navigation systems and portable data devices. AVX Corp., Myrtle Beach, S.C.
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POWER CONNECTOR — The Sumo Power Connector is designed as a drop-in replacement for top drawer connectors. It is available in cable, straight PCB and right-angle PCB terminations. Three-level sequential mating is available for each contact size 12, 16 and 20. Size 0 contacts have a current carrying capacity to 200 A. Positronic Industries Inc., Springfield, Mo.
NEWS BRIEFS:
Bishop & Associates Helps Develop National Connector Roadmap
Bishop & Associates has teamed with APEX Electrical Connector Consultants and others to research and produce the first connector roadmap to be included in the National Electronic Manufacturing Initiative's (NEMI) bi-annual roadmap report. Roadmapping is a new form of forecasting that identifies critical technologies, technology gaps and roadblocks in business plans. This process was formulated mainly from North American inputs, but is also applicable to the global market. "The NEMI roadmap brings together OEMs, contract manufacturers and the supply chain to gauge future needs of the electronics manufacturing industry," said Jim McElroy, executive director and CEO of NEMI.
ECA Reports February Component Order Index Up
The Electronic Components, Assemblies & Materials Association (ECA) reported component orders increased in February compared to last year. However, falling prices kept revenue growth flat. "Despite the geopolitical uncertainty facing most companies today, business is better than last year and growth appears to be poised for upward movement over the next six months," said Bob Willis, President of ECA. Willis expects demand will increase growth in most segments of the electronics economy.
Ideal Industries Appoints Ned Camuti Vice President of Wire Termination Unit
Ideal Industries Inc. (Sycamore, Ill.) promoted Ned Camuti to Vice President/ General Manager of the Wire Termination Business Unit. Camuti is responsible for strategic planning, marketing and finances for the unit. He has held several positions within the company prior to this promotion, including Director of Marketing for the Electrical Division. Camuti reports directly to President and CEO Robert N. Lane.
Fleck Research Releases 2002 Market Overview
Fleck Research, a global connector research group, has released its 2002 Market Overview. The report details the performances of various industry sectors in 2002, as well as providing a forecast for 2003. According to Fleck, it is a buyer's market in the sectors of computer, telecom, communication/wireless, networks, instruments and consumer electronics, and a seller's market in the military/aerospace, automotive and medical sectors.
NEWSMAKERS:
PXI Systems Alliance (San Diego, Calif.) named Teradyne Marketing Manager Bob Stasonis as President. Loofie Gutterman, President of Geotest, was named Director of Marketing.
Molex Inc. acquired certain assets of Schott Optovance (Southbridge, Mass.), including the Optical Shuffle® and Light Dealer™ product lines. Molex has transferred operations to its Bolingbrook, Ill. facility.
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Irvine, Calif.-based Sabritec appointed Peter Boreham as European Business Development Manager. Boreham will provide technical support to the European market.
FONS Corp. (Northborough, Mass.) acquired certain assets of Spokane, Wash.-based Spoval Fiber Optics Inc. Mark Fralich was named a Director of Sales for FONS in the Western region.
Teradyne Inc. has sold its Manufacturing Software Group (Alpharetta, Ga.) to NetVendor Inc. The two groups merged to become Visiprise Inc., a manufacturing solutions provider.
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Bead Electronics, a division of Bead Industries, relocated operations to a renovated facility in Milford, Conn. The building houses the company's manufacturing and management offices.
