WAKEFIELD, Mass. — The Executive Membership of the PCI Industrial Computer Manufacturers Group (PICMG) has voted to adopt Revision 1.0 of PICMG 3.0, the base specification for the new AdvancedTCA family of specifications.
"Advanced Telecom Computing Architecture is the first open industry specification for carrier-grade equipment incorporating high-speed switched fabric technology," said Joe Pavlat, PICMG President. "AdvancedTCA systems are capable of switching and processing 2.5 terabits per second in a single shelf."
The PICMG also announced development of a fourth backplane fabric specification in the AdvancedTCA family, denoted PICMG 3.4. This will define the electrical environment for PCI Express as a fabric interface for AdvancedTCA system applications. The electrical environment described in the new specification will support PCI Express Core and PCI Express Advanced Switching silicon implementations. PCI Express describes a packetized protocol and a layered architecture. It offers high bandwidth, performance and scalability.
The PICMG 3.4 Advanced.TCA PCI Express specification will map the PCI Express and PCI Express Advanced Switching signaling onto the AdvancedTCA backplane to provide switched, high-speed, low-latency point-to-point connectivity among node, fabric (switch hub) and full mesh boards for PCI Express interconnects. Pin mappings for node and fabric cards/ slots will be defined for the dual star, dual-dual star and mesh fabric topologies defined in the PICMG 3.0 core specification.
"The addition of PCI Express to the AdvancedTCA fabrics offers system designers the capability of implementing this new fabric technology quickly in a standard form factor," said Dick Somes, PICMG's Technical Officer. "AdvancedTCA is the ideal form factor to bring PCI Express technology to telecommunications."
PICMG 3.4 AdvancedTCA PCI Express joins the other AdvancedTCA specifications now in progress: PICMG 3.0, the AdvancedTCA core specification; PICMG 3.1 for Ethernet; PICMG 3.2 for InfiniBand and PICMG 3.3 for StarFabric. The goal is to create the foundations for a set of common platforms with a large selection of interchangeable modules from many companies.
Serial Attached SCSI
SAN FRANCISCO — The SCSI Trade Association (STA) announced that the InterNational Committee for Information Technology Standards (INCITS) Technical Committee T10 has completed its work on the Serial Attached SCSI specification and has released the letter ballot. The letter ballot marks a significant milestone in the standardization process and marks the beginning of the implementation phase of
Serial Attached SCSI during which companies solidify designs. The ballot meets the year-end forecast established by the working committees over a year ago.
The Serial Attached SCSI standard defines a device-level enterprise storage interface incorporating SCSI backward compatibility, serial point-to-point interconnections, dual porting, increased addressability and the ability to scale to small form factors. Its physical layer is compatible with Serial ATA (SATA), giving future users the choice of populating their systems with SCSI or SATA hard disk drives or a combination of both.
Harry Mason, President of the STA Board of Directors, stated, "This is an important milestone on the path to Serial Attached SCSI's standardization and we anticipate that products will be released to the market in early 2004. Enterprise storage users will have the unprecedented choice of SCSI or SATA hard disk drives in a Serial Attached SCSI system plus the comfort of familiar SCSI software and middleware."
Insilco Sells Business Units
Insilco Holding Co. (Dublin, Ohio) announced that its primary operating subsidiary, Insilco Technologies Inc., has agreed to sell the assets of its three business segments. The company plans to sell the passive components business to Bel Fuse Ltd.; a majority of the custom assembly business to Amphenol Corp.; the North Myrtle Beach custom assembly business to LL&R Partnership; and the stamping business to SRDF Acquisition Co. LLC.
New Standards Announced
The ANSI/TIA-604-13 — FOCIS13 — Fiber Optic Connector Intermateability Standard, Type SFOCC1.25 document is now available. The following documents have been reaffirmed: ANSI/ TIA-604-2 — FOCIS2 — Fiber Optic Connector Intermateability Standard; ANSI/TIA-455-134 — FOTP134 — Measurement of Connector Ferrule Hole Inside Diameter; and ANSI/TIA-455-135 — FOTP135 — Measurement of Connector Ferrule Inside and Outside Diameter Runout.
National Design Show Coming in March
The National Design Engineering Show is being held March 3-6, 2003, at Chicago's McCormick Place Complex. Information can be found on integration systems, materials and motion control, components, product lifecycle management and supply chain. In addition, the show will debut the Technology Transfer Conference and Expo, and NASA will be returning with exhibits and information.
Web Site for Solder Paste Users
A new Web site launched by EFD Inc. (East Providence, R.I.; www.efdsolder. com) gives companies that use solder paste detailed information to help them improve their production processes. The site features a tutorial on solder pastes, real-life application reports, technical data sheets and white papers on a wide variety of solder-related topics. EFD produces solder pastes for use in SMT, electronic, mechanical and electromechanical assembly processes.
WAGO Adds to Partners Program
WAGO Corp. (Germantown, Wis.) has added Advanced Production Systems Inc. (APS) to the WAGO Innovative Partners Program. APS manufactures I/Gear, an enterprise connectivity tool and data transport utility. "This partnership expands the functionality of the WAGO I/O System, offering customers more possibilities to connect and use data to improve their business," said Michael Lane, President of WAGO.
W. L. Gore and JAE Develop InfiniBand Assemblies
ELKTON, Md. — W. L. Gore & Associates Inc. and Japan Aviation Electronics Industry Ltd. (JAE) have combined their technologies to deliver higher performing InfiniBand cable assemblies. In addition to providing improved mechanical and electrical performance, the assemblies are compliant with the InfiniBand Trade Association (IBTA) specifications.
The new InfiniBand cable assemblies will provide performance at InfiniBand data rates (2.5 Gbps per lane) as well as perform at 3.125 Gbps per lane. These assemblies will be available for customers with 4X and 12X needs.
"We are pleased to join forces with JAE to develop higher performing InfiniBand cable assemblies," said David Dillon, Product manager for Gore. "By combining JAE's wealth of connector knowledge and experience with our years of experience in cable design and termination, we can better meet the needs of our InfiniBand customers."
"By focusing the knowledge and experience of JAE and Gore on the development of high-speed 4X and 12X interconnect solutions, we have been able to achieve many improvements in both performance and quality for our InfiniBand customers," said Jim Balistreri, Industry Marketing Manager for JAE. "Through our continued efforts, we hope to bring even more improvements in the future."
ITT Industries To Acquire VEAM/TEC
WHITE PLAINS, N.Y. — ITT Industries Inc. announced it has signed an agreement with Northrop Grumman Corp. to acquire the VEAM/TEC division of Northrop Grumman's Component Technologies sector. VEAM/TEC designs and manufactures cylindrical, filter and fiber optic connectors for the military/aerospace, industrial, transit and nuclear markets. Financial terms of the acquisition were not disclosed.
"The acquisition of VEAM/TEC is consistent with our long-term strategy of expanding our footprint in higher growth, profitable markets," said Gerry Gendron, Senior Vice President of ITT and President of ITT Industries, Cannon. "VEAM/ TEC significantly broadens the product portfolio and capabilities we are able to offer our customers and its expertise in high-reliability products is a perfect complement to our heritage of designing products for the harshest environments. It's a great fit for Cannon's existing business."
VEAM/TEC was founded in 1936 and has a product portfolio that includes composite circular, fiber optic, high-density rectangular and high-power/high-voltage connectors. The company has its headquarters in Watertown, Conn., with primary manufacturing in Milan, Italy and additional facilities in Scotland, England and Germany. Estimated sales for 2002 are $47 million.
NEWSMAKERS:
Memphis, Tenn.-based Thomas & Betts Corp. elected Dominic J. Pileggi to the newly created position of President and COO of the company. Pileggi is responsible for the company's global business operations.
Optical Cable Corp. (Roanoke, Va.) appointed Charles W. Carson Senior Vice President of Marketing and Strategy. Carson will focus on the development of marketing and sales growth strategies.
Michael McGuire joined Plexus Corp. (Neenah, Wis.) as Vice President, Sales and Business Development. McGuire is responsible for developing and implementing sector-based sales and business strategy on a global basis.
Ericsson Network Technologies AB (Stockholm) appointed 3SAE Technologies Inc. (Nashville, Tenn.) as the exclusive Authorized Service Center in North America. 3SAE will provide service and support in the United States, Canada and Mexico.
CableTest Systems Inc. (Markham, Ontario) appointed Captec as its exclusive sales representative for North California and Northern Nevada. Captec maintains office and demonstration facilities in Fremont, Calif.
Henkel Loctite Corp. (Industry, Calif.) named Thomas C. Lipinski as Sales Manager for the company's electronics business unit. Lipinski will focus on increasing sales in the Midwestern, Southwestern and Western United States.
Fairmont, Minn.-based Aerospace Systems, a division of Nortech Systems, hired Thomas J. Zola as a Field Sales Engineer for the Northeastern United States.
