HARRISBURG, Pa. —Tyco Electronics announced a new backplane design technique, which when coupled with its Z-PACK HM-Zd connector, results in improved performance for 3.125 to 6.25 Gbps serial links while simultaneously reducing backplane fabrication costs. The QuadRoute technique is intended for use with the Active Interconnect, which is a system interconnect that has been designed to use the synergistic interaction of all the passive and active components to enhance overall system performance.
By utilizing the footprint of the Z-PACK HM-Zd connector, which has 2.5 mm spacing between signal columns, two differential pairs can be routed between the signal columns with enough isolation to minimize crosstalk between the two pairs. Using the QuadRoute technique, the signal layer count of the backplane can potentially be cut in half, which can economically justify the use of higher performance materials to reduce the predictable losses associated with dielectric losses. Furthermore, this routing density can help minimize overall board thickness, which helps minimize noise associated with the connector footprint and the associated unpredictable losses caused by the connector/board interface. This results in predictable behavior for all signal layers throughout the entire backplane. The thinner backplane reduces the capacitive effect of stub lengths, thereby reducing the need to utilize counterbored plated through holes. The reduced number of layers and smaller trace spacing result in greater three-dimensional signal densities in the backplane.
"Tyco Electronics has helped pioneer the evolution of the Active Interconnect from its participation in the development of XAUI to its leadership role in the High Speed Backplane Initiative. Our industry involvement and relationships with various chip vendors have helped Tyco Electronics understand the various chip techniques potential and limitations," stated John D'Ambrosia, Manager of Semiconductor Relations for Tyco Electronics. "This understanding has helped us exploit the product features of the
Z-PACK HM-Zd connector to reach new performance capabilities not seen without resorting to techniques such as counterboring," he added.
Cable and Harness Certification Program to be Established
NORTHBROOK, Ill. — IPC — Association Connecting Electronics Industries announced that Soldering Technology International Inc. (STI) has been contracted to develop a training and certification program for IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Harness Assemblies."
The IPC/WHMA-A-620 Certification Training Program will be a two-tier, "train-the-trainer" approach that provides traceability from certified instructors to operator-level training programs. It will support common understanding and implementation of the technical requirements contained in IPC/WHMA-A-620 and will also allow traceable certification for demonstrated capability through application of the standard acceptance criteria for quality programs.
The IPC Wire Harness Acceptability Task Group of the Product Assurance Committee and the Wiring Harness Manufacturers Association Industry Technical Guidelines Committee developed the IPC/WHMA-A-620 and released it in January 2002. It is modeled after the IPC-A-600 and IPC-A-610, two industry standards for printed wiring boards and circuit assemblies, and is the first industry consensus standard for cable and wire harness fabrication and installation.
Motorola Launches Platform Supporting Backplane Specification
TEMPE, Ariz. — Motorola Computer Group, a part of Motorola Inc., has launched the MXP3321, which is a platform built to the recently ratified CompactPCI Serial Mesh Backplane (CSMB) specification. Designated PICMG 2.20, CSMB is a point-to-point serial interconnect that can scale to more than 700 Gbps. Based on the core PICMG 2.x specifications that have been adopted throughout the telecommunications, enterprise and industrial markets, CSMB also provides parallel capability with the proposed AdvancedTCA PICMG 3.x specification. The MXP3321 targets multi-service switching applications such as multi-protocol routers, 3G wireless radio network controllers and media gateways.
Now, CSMB offers telecom equipment manufacturers an industry-standard means of connecting multiple networks featuring different types of traffic. This enables developers to distribute traffic across the backplane of an MXP3321 in its native format. Because the communication between any two slots does not depend on what protocols may exist elsewhere in the platform, this architecture can be easily adapted to fit many different applications.
"Many companies building multi-service switches and related applications need a switch fabric now – one that is an industry standard – that meets their cost, footprint and functionality requirements for OC-48 and below network edge applications," said Jeff Rhodes, Business Manager, Motorola Computer Group.
VITA Chooses Ermet ZD Connector for VITA 34
CHESTER, Va. — The VMEbus International Trade Association (VITA) voted for the high-speed ERmet ZD differential connector system to be used in the new serial computing architecture VITA 34 for next-generation systems. Also recently specified by PICMG as the high-speed data transport connector for the next generation of the telecommunications architecture, the ERmet ZD products get more and more established as the connector standard for high-speed industry and telecom applications. The differential ZD connectors are a joint development with Tyco Electronics and ERNI Components Inc.
Switched fabric interconnects are emerging as the next technological wave for communications systems. The VITA standards organization is promoting the switched fabric approach with the new VITA 34 standard. Switched fabric realizes demand-orientated communication with economical use of the resources. The evolution of integrated circuitry, mainly the requirements of processors operating at gigahertz speeds and high data rates, requires several changes, from the mechanical to the cooling to the power supplies.
Starting with the subrack, VITA 34's initial developments look to have a module pitch on the backplane of 1.2". The modules are 4 or 8U high and 220 mm deep, and they are enclosed with sheet metal. The mechanical task group is discussing how to assign the connector areas on the module.
"The decision of the VITA organization will further accelerate the acceptance of Ermet ZD throughout the electronics industry," said Andreas Scheck, Marketing Director at ERNI. "With its proven performance for handling high-speed differential signals up to 5 Gbps with high signal integrity, the dual-sourced ZD connectors fulfill the needs of the next-generation VME applications."
NEWS MAKERS:
Advanced Circuit Technology Inc. (Nashua, N.H.), a supplier of flexible circuits, hired James M. Mahoney as Project Leader for the company's entry into the rigid and multilayer flexible circuit market segments.
Henkel Loctite Corp. (Industry, Calif.) named Chris Marinelli as Director of Applications Engineering for the company's electronics business unit. Marinelli is responsible for all electronics technical service and product development activities in North, Central and South America.
Yamaichi Electronics USA Inc. (San Jose, Calif.) appointed Bassam Asfoor as Regional Sales Manager in the Phoenix area. Asfoor reports to Al Muranaga, Senior Vice President of Sales and Marketing.
Winchester Electronics (Watertown, Conn.), a business unit of Northrop Grumman Corp.'s Component Technologies Sector (Iselin, N.J.), relocated to a new facility in Wallingford, Conn.
San Jose, Calif.-based Kycon Inc. received certification from the USB Implementers Fourm (USB-IF) for the company's standard USB connectors.
IPC-Association Connecting Electronics Industries (Northbrook, Ill.) honored past IPC Chairman Ron Underwood with its 2002 Raymond E. Pritchard Hall of Fame Award. The award is based on exceptional lifetime achievement.
WAGO Corp. (Germantown, Wis.) received continued registration and an upgrade to the ISO 9001:2000 standard.
Avnet Kent (Phoenix) is now known as Avnet IP&E. The new name is intended to provide clarity and consistency.
NEWS BRIEFS:
Harting Moves to China
Harting North America moved manufacturing from its headquarters in Elgin, Ill. to the company's factory in Zhuhai, China. This move follows other telecom OEMs that have moved manufacturing to China to lower costs. Sales and marketing functions remain in the Elgin facility. These resources will focus on industrial applications, as well as prepare for new growth opportunities.
Turck and InterlinkBT Partner
Minneapolis, Minn.-based Turck Inc. and InterlinkBT have partnered to form Turck Process Automation. The partnership will supply products to process automation markets. It will also focus on developing and adapting products for the oil and gas, power and pharmaceutical markets. "This new partnership allows us to take our proven solutions in connectivity, interface technologies and sensing to a market that truly appreciates the value of getting a plant up and running fast and trouble-free," said Jim Masterson, Vice President of Turck Process Automation.
Molex Names Distributor
Molex Inc. named Chicago-based Newark Electronics as a direct distributor of Molex's full line of products in North America. The agreement was effective July 1, 2002. Eric Sussman, Director of Distribution for Molex, said, "In partnering with Newark, a well established name in the electronics industry, we will be able to reach new customers and new markets."
Pioneer Cable Expands
Pioneer Cable Co. (Wichita, Kan.), a manufacturer of cable assemblies and wire harnesses, has added more than 150,000 sq ft of production capacity to its existing operation. This allows the company to offer end-to-end production. Thomas Anderson, President, commented, "With this new, vertically integrated production capability in place, the Pioneer Cable team can assist customers with a complete, one-stop production solution."
