ARLINGTON, Va. — The Telecommunications Industry Association has published a new standard, "Fiber Optic Connector Intermateability Standard (FOCIS) 5 — Type Multi-Fiber Push On (MPO)," TIA-604-5B. The document is a revision of TIA/EIA-604-5A.
The standard presents the intermateability standard for connectors with the commercial designation of MPO and is used as an addendum to TIA/EIA-604. The provisions of TIA/EIA-604 apply to this document.
Report Examines the Effect of New Connector Applications
NORTHBROOK, Ill. — IPC — Association Connecting Electronics Industries has introduced "The Impact of Emerging Connector Designs on Printed Circuit Design and Fabrication," a recently commissioned report from Prismark Partners LLC, an electronics industry consulting firm. The 31-page report presents the findings from Prismark's research on the impact emerging connector applications will have on the design and fabrication of printed circuit boards and an insight into the potential need for new board geometries, materials and constructions.
The report divides and analyzes five connector applications groups: 1) signals within network systems, 2) signals from network systems, 3) power to and within network systems, 4) connectors in high-reliability systems and 5) connectors in handheld systems. The three network systems segments include data communications, telecommunications, servers and data storage.
In its research, Prismark conducted interviews with designers and product engineers in all five of the aforementioned groups. The interviews produced insights and discussion points, including a description of today's leading-edge connectors, necessary board geometries to accommodate new connectors, board materials and constructions specifically driven by the use of connectors, major upcoming forces that are driving the use of new connectors, design of new connectors including pitch and through hole/surface mount, and board implications, such as line width, hole size, layer count and materials.
The data is also aggregated into a series of roadmaps for four major application areas: network systems, portable systems, high-reliability systems and special applications. The roadmaps show the anticipated timing and technology of how connector changes will affect board design and fabrication.
