New paper investigates enabling technologies for board-level optical interconnects - Connector Specifier

New paper investigates enabling technologies for board-level optical interconnects


Jun 25, 2010

GLEN ALLEN, Va. -- CIR has released a new paper titled, "Enabling Technologies for Board-level Optical Interconnects." The paper was drawn from a recent report from the firm, "New Revenue Opportunities for Optical Interconnects: A Market and Technology Forecast", that predicted that revenues from optical interconnect products will exceed $3.5 billion ($US) revenues by the year 2015.

The paper is available for free download on the CIR website at http://www.cir-inc.com/products/prod_detail.cfm?prod=1&id=236.

CIR believes that significant new business opportunities are emerging for suppliers of optical interconnect technology including firms with roots in the diode laser, active optical cabling, transceiver, and semiconductor industries as well as those that supply this industry with connectors and fiber-optic cables.

Related News:  Optical hardware market dips in Q1, finds Infonetics

In the recently published analysis, cited above, the firm indicates that there are essentially two kinds of opportunities, rack-based interconnects that CIR expects to generate as much as $3.5 billion by 2015 and board-based and chip-based systems, the focus of the paper.

While these types of systems may not generate significant revenues directly for eight to ten years, CIR contends that they are needed now as a key enabling technology for computer and telecom/datacom equipment which is increasingly limited by the speed of internal connections when it comes to deploying the latest processors. This is the reason that major firms from the computer sector have made announcements in board-level interconnection in the past year.

For more information, go to http://www.cir-inc.com/

 

 


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