November 11, 2009 – Japan Aviation Electronics (JAE) has developed a new ST1 Series connector to meet the market demand for an even smaller connector for the MicroSD (TransFlash) card used in multiple portable applications. The size of the new hinge-type high-density SMT connector has been reduced by 40 percent of the original version, and the mounting area has been reduced by 20 percent. Specific dimensions: Height of 1.4mm, depth of 15.5 mm, and width of 11.9mm.
The new ST1 connector has a push-slide structure and balanced EMI control through four hold-down grounding points. Other features include a locking structure that prevents the cover from falling off when dropped and availability with or without card-insertion detection. Specifications include 8 contacts (plus 2 additional contacts for the D-SW type), 0.5A current rating, 1000 Mohm insulation resistance, and 100 Mohm maximum contact resistance. Durability is rated at 10,000 times.
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