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Design and Test Articles
LeCroy intros external PCIe cable interposer for PCI Express 2.0 analysis
(Mar 8, 2010)
An enhancement to the Lecroy Summit PCI Express Protocol Analyzer, the interposer provides a dedicated probe whereby engineers may analyze data traffic between a host and device connected using an external PCI Express cable.
Mentor Grahics' HyperLynx PI wins 2010 Design Vision award for system modeling and simulation
(Feb 10, 2010)
The solution provides fast-time-to-accurate-results in analysis of AC and DC behavior for PCB power distribution networks.
Mentor Graphics enhances HyperLynx signal, power integrity simulation platform with full-wave 3D analysis
(Feb 2, 2010)
Announced at DesignCon 2010, new functionality has been integrated with the Mentor Graphics' HyperLynx product suites that will analyze, in full electromagnetic detail, 3D structures such as vias, solder bumps, wirebonds, and edge connectors.
Ixia, Agilent offer HDMI 1.4 test platform
(Jan 28, 2010)
Combining Ixia's IxN2X traffic generator with Agilent's HDMI Ethernet Channel (HEC) and Audio Return Channel (ARC) physical layer test solution, the two companies jointly bill themselves as the first to offer a complete solution for testing devices according to the HDMI 1.4 Compliance Test Specification (CTS), Supplement 2.
JDSU intros handheld optical testers for enterprise, broadband services
(Jan 19, 2010)
At the 2010 BICSI Winter Conference, JDSU has introduced a family of optical test instruments and kits, the JDSU Optical SmartPocket handhelds, to support enterprise and broadband service providers. 
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Design and Test Products
LeCroy adds VPX Interposer for PCI Express 2.0 analysis
(Mar 9, 2010)
The VPX interposer provides a dedicated probe that makes it easier to analyze data traffic between a VPX host system and carrier board system.
VITA 46 VPX test backplane for board developers introduced by Elma Bustronic
(Mar 9, 2010)
The two-slot test backplane, designed to VITA 46 specifications, enables the user to power up and test J1 fabric connections as if he were interconnected in the target application.
Harwin's EZ-BoardWare SMT components target EMC, cable management and test applications
(Feb 25, 2010)
Harwin says its new brand of EZ-BoardWare SMT components provide simple, cost-saving solutions for EMC and cable management and test applications.
SiSoft's QCD Design Kits optimize serial link designs for high-speed interconnects
(Feb 19, 2010)
Kits are available for delivery from IP and semiconductor vendors including Xilinx, IBM, LSI Logic and Synopsys.
Samtec Edge Card sockets feature signal integrity-optimized contacts for high speed apps
(Feb 19, 2010)
Samtec's Edge Card Sockets with are intended for high-speed micro board-to-board and micro backplane applications.
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