Connector Specifier Articles, April 2006

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ISA forms standards committee for field device tools

ISA-the Instrumentation, Systems, and Automation Society (www.isa.org)-has formed a Field Device Tool (FDT) Interface Specification standards committee, ISA SP103, that will develop a standard to fully integrate fieldbuses, devices and subsystems as seamless parts of the automation lifecycle.

Manufacturing gets a close look at WHMA annual conference

Attendees of the Wiring Harness Manufacturers Association’s (WHMA; www.whma.org) 2006 annual conference, held March 22-24 in Indianapolis, heard about more than the latest in connectivity, wire stripping, and marking technology.

Third Tin Whisker Workshop slated for ECTC

International Electronics Manufacturing Initiative (iNEMI; www.inemi.org) will co-sponsor the third annual Tin Whisker Workshop with the IEEE Components, Packing and Manufacturing Technology Society (CPMT; www.cpmt.org), and the 56th Electronic Components and Technology Conference (ECTC; www.ectc.net).

Filter technology takes stress out of thermal shock

SANTA ANA, CA - ITT’s new Cannon Chip on Flex (CoF) filter technology has been designed to virtually eliminate all stress from thermal shock and vibration while providing what the company claims is superior protection to sensitive electronics-all in a new, lighter weight package.

Editor's View

Communications, connections, commitment

More than anything else, I’d like to open this, my first editorial as Connector Specifier’s chief editor, with a statement of appreciation for the opportunity to serve the connectivity industry.

Industry Insight

Why RoHS impacts your company, even if it is exempt

Hundreds, if not thousands of electronic components and products are set to become obsolete when the European Union’s RoHS (Restriction of Hazardous Substances) directive takes effect this July.

Products

New Products

Focus On

Features

Self-aligning MEMS connectors go ultra-high-density

Prototype in-line connectors with a micron-scale pitch outperform previous MEMS-based attempts.

Compression probe technology makes sense in logic analyzers

Compression probe interconnect technology has mechanical and electrical advantages in logic analysis.

Building wiring harnesses to save costs in chassis and racks

A cost benefit analysis can help you determine when a wiring harness should and should not be used.

This Issue

Volume 22
Issue 4
April 2006
 

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