Connector Specifier Articles, March 2005

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News

Pulse announces RoHS compliance initiatives

SAN DIEGO - Electronic component manufacturer Pulse, a Technitrol Company, announced its plan for compliance with the Restriction of Hazardous Substances (RoHS) European Union Directive.

ADC and Corning Cable Systems enter into technology transfer agreement

ADC (Eden Prairie, MN) and Corning Cable Systems (HICKORY, NC) agreed upon a technology transfer agreement for one of Corning Cable Systems’ industry-leading hardened connector products.

IPC revises IPC-A-610 and J-STD assembly standards

Bannockburn, IL - For electronic interconnect industry manufacturers stressing over the planning for lead-free electronics manufacturing, stress no more.

BPA and QPG combine forces for Executive Briefings

UK-based BPA Consulting Ltd. and U.S.-based Quantum Performance Group, LLC are combining forces to present Executive Briefing Meetings (EBMs) on “Next Generation Interconnect Technology for High Speed and Miniaturized Systems.”

Editor's View

The end of Moore’s Law?

In spite of the intense rain in Anaheim, CA, attendees came out in strong numbers for the IPC Printed Circuits Expo/APEX/Designers Summit, held February 22-24, 2005, at the Anaheim Convention Center.

Products

New Products

Focus On

Features

Get the latest on fiberoptic connector standards

Evolving fiberoptic standardization efforts for harsh-environment avionics now address parts, methods, practices, training, and testing.

Ceramic planar-array capacitors stack up against the elements

The heart of the filter connector is the capacitor array. The layered planar-array capacitor helps filter connectors go above and beyond in harsh environments.

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Volume 21
Issue 3
March 2005
 

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